CMOS Sensor Inc. manufactures a range of CMOS linear sensors with different resolutions. These can either be used singly or assembled into a longer series. Areas of application include amongst other things the industrial quality control and the consumer market. However, the products of this manufacturer have also been used successfully in other applications, for example in the aerospace industry. Eureca is the European sales office for CMOS Sensor Inc.
CIS modules consist of rows of CMOS image sensors, LED lighting and linear optics in a compact housing. The individual CMOS image sensor chips are manufactured on wafers and can be used in a variety of applications such as check readers, color scanners, digital copiers, mark readers, barcode readers, OCR, edge detectors, positioning and optical encoding and more.
The table provides an overview of the specifications of the available sensors. Not all are listed in the modules presented below, as these are not available in small quantities. In principle, however, all possible variations (in larger quantities) can be ordered and produced. Please contact us for an individual offer!
|CIS Module||DPI||Pixels||Image Length|
These individual CMOS image sensor chips are also designed for the application of Silicon Butting Contact Image Sensor (CIS) modules. A chip can be connected to another chip to form a long image sensor module. CIS modules are elementary components of many fax machines and scanners. Modules are available in the standard lengths of 24 mm, A9, A8, A6, A4, A3, ..., A0 in resolutions from 100 to 600 dpi.
The CIS modules listed here are optimized for scanning documents in »contact mode«. This means that the object to be scanned is guided past the sensor on the front glass plate.
For applications where a greater working distance is required, the modules can be disassembled to separate the individual components for example in a custom housing at the appropriate new intervals. In this way, these modules can also be used for the control of continuous goods in the industry (films, fabric, paper and the like).
It should be noted, however, that the working distance to the CIS module is maintained very precisely by good guidance of the object to be tested in order to be able to use the optimum optical resolution of the module.
The CIS modules can also be supplied on request with a minimum order quantity and without a linear optic and LED board. Hereby they can be used as a long CMOS line sensor for for example the position detection of laser beams.
From a certain order quantity, customized modifications of the modules are generally possible. These include, i.a. customer-specific housings, several parallel data outputs to increase the read-out speed or the assembly with special LEDs. Likewise, the individual CMOS sensors from which the CIS modules are made internally are available for own OEM projects in wafer form. Please contact us if interested.
The IPL camera is a line scan camera for industrial applications and suitable for the flat surface AOI inspection. These cameras have been developed for applications that require large-format optical scanning of materials and require a continuous, undistorted image. Available in 0.25–1.25 m (up to 3 m or longer), so for example the inspection of a Gen 8.5 LCD production line with a 2.2 m × 2.6 m glass substrate is possible with an IPL camera at least 2.25 m long.
The IPL camera is compact, robust, and all internals like lens, sensors, circuitry, etc. are housed into just one unit. So manufacturers get a reliable, low maintenance, and cost effective solution for providing the highest quality products to their customers.
Lieferbar in Scanlängen von 260mm bis über 3000mm:
|Scanner model||Scan length [m]||Pixel number|
Example image with scale
Topographic Map of Taiwan, captured by C468
Radiation specifications are:
You want to learn more about CMOS space sensors? Here are two documents provided by CMOS Sensor Inc. on their Space Satellite Sensor subpage.
|Type||Pixel||Pixel Size [µm]||Output||Remarks|
|C640||4000||7 x 7||12Bit digital||Single Frame / Multi-Frame Pixel Capture Operating Mode for 3D Terra Mapping Camera (TMC) application|
|C650||256 x 512||50 x 50||12Bit digital||Large image area, row wise gain compensation, long integration time for Hyper Spectral Imager (HySI) camera application|
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Last update: 2022-12-05