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Sockets with Carrier

On request Andon provides many sockets with a placement aid, a so-called carrier. Here, the socket is delivered plugged on an auxiliary component—the carrier—, which is removed and disposed of after the soldering process. Alternatively, the carriers can also be sent back to Andon, where they are newly equipped with terminals.

The carrier technique is suitable e.g. for the following applications:


DIP socket without connecting bars

Conventional DIP sockets have either a solid insulator plate or at least two connection bridges between the pin rows. If this space is needed on the pcb e.g. for other components, sockets with carrier are used. After removal of the carrier remain in principle only two rows of SIP sockets on the board, which are also optimally aligned with each other.

Before soldering.

While soldering.

After soldering.


Low-profile assembly

A very space-saving assembly variant is to completely dispense the insulator of a socket. For the soldering process, the socket terminals are delivered plugged onto a support carrier and with its help they are mounted onto the pcb. After the soldering process and the removal of the carrier, only the soldered terminals remain on the board.

This technique is used i.a. with the following base variants:

Ultra-Low-Profile SIP

Before soldering.

While soldering.

After soldering.


Ultra-Low-Profile PGA 

Before soldering.

While soldering.

After soldering.


Ultra-Low-Profile DIP

Before soldering.

While soldering.

After soldering.


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Last update: 2018-28-11