Rollerball™ Sockets eleminate many problems inherent in the shipping an assembly of conventional BGA sockets. The unique design also improves performance characteristics and reduces expensive rework and scrap while increasing production yields. The key to Andon's new design is a radiused hole at the bottom of the terminal. The terminal is then crimped over the solder ball beyond its hemisphere to encapsulate the solder ball, leaving just enough of the solder ball exposed to provide sufficient solder for soldering to a PCB.
Some ASICs with large ball counts using the conventional BGA terminal design experience coplanarity tolerance problems when there is no metal-to-metal contact between the solder ball and the PCB pad. The solder ball will tend to flow toward the gold plated land area under the microprocessor or socket terminal and not downward to make contact with the PCB pad.
With Andon's Rollerball Socket design, the critical distance between the terminal and the PCB pad is typically reduced from 0.036"–0.040" to 0.018"–0.022". The solder becomes part of the »anchor« cross section and provides additional mechanical strength to the connection as well as improved electrical connectivity. Because it also provides controlled dispersion of solder, the encapsulated solder ball in the new Rollerball™ Socket also reduces the risk of solder bridging inherent in conventional solder ball terminal designs.
Designed to revolutionize BGA assembly and improve reliability and quality!
Here you can easily ask a question or inquiry about our products:
Last update: 2018-27-11