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Verwendung von Sockeln für Bildsensor, um die Produktionskosten der Kamera zu senken

Risiken der direkten Montage

Risks associated with mounting an image sensor directly onto your imager board:

  • Image sensor yield losses from exposure to high temp solder, ESD, and cleaning solutions.
  • Cracked solder joints and associated intermittency due to differences in CTE between image sensor and imager board.
  • The imager board yield losses or repair labor associated with de-soldering a faulty image sensor.
  • Tying up cash with expensive image sensor inventory (in order to offer prompt delivery) OR offering longer production lead time (in order to avoid tying up cash with expensive image sensor inventory).
  • Imager performance degradation due to excessive heat and noise.

Solution

Insert your image sensor into the socket after the imager board is soldered and cleaned.

  • The Image sensor is no longer exposed to high temp solder, ESD, and cleaning solutions.
  • Socket contact functions as »shock absorber« to avoid solder joint cracking.
  • No need to de-solder faulty image sensors … simply remove from socket.
  • Solder and clean imager board before image sensors arrive, to maintain competitive lead time without tying up cash with inventory.
  • Patented »Heat Sink Socket™«M dissipates heat and reduces noise.

Factors to Consider in Socket Usage

  • Image sensor yield loss rate from exposure to high temp solder, ESD, and cleaning solutions.
  • Solder joint cracking rate x avg. solder joint repair labor rate solder joint repair labor time x avg.
  • Faulty image sensor de-soldering rate x avg. time to de-solder x avg. de-solder labor rate.
  • Importance of simultaneously reducing camera production lead times while preserving cash.
  • Need for, and effectiveness of, image sensor heat dissipation.

Factors to Consider in Socket Usage

  • Image sensor yield loss rate from exposure to high temp solder, ESD, and cleaning solutions.
  • Solder joint cracking rate x avg. solder joint repair labor rate solder joint repair labor time x avg.
  • Faulty image sensor de-soldering rate x avg. time to de-solder x avg. de-solder labor rate.
  • Importance of simultaneously reducing camera production lead times while preserving cash.
  • Need for, and effectiveness of, image sensor heat dissipation.

Why Socket Usage is Surging Among Leading High-Res Camera Makers

  • Trend toward higher resolution, larger, more expensive image sensors → Any yield loss is unacceptable.
  • Sockets now recommended by the leading image sensor makers.
    • Avoid uncomfortable liability debate when devices get damaged during soldering/cleaning/handling.
    • Build customer goodwill.

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Aktualisiert am: 29.11.2018