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BGA and mini PGA sockets by Andon Electronics Corp.

Andon's BGA Sockets and Adapters provide an ideal method for mounting ball grid array devices onto a PCB. The device is soldered to the adapter, greatly simplifying solder verification and testing. The device/adapter assembly then plugs into the BGA socket which is permanently soldered to the PCB. The BGA adapter is offered with either flat or countersunk heads. Our BGA sockets can be surface of thru-hole mounted. Socket insulators are made of FR-4 to withstand convection or IR soldering. Andon's BGA sockets and adapters are available in virtually any size or configuration, using off the shelf or custom designed screw machined terminals.

Overview of the available BGA socketsl

Back to the overview of the socket products by Andon

Designed to revolutionize BGA assembly and improve reliability and quality!

Rollerball Sockets estimated many problems inherent in the shipping an assembly of conventional BGA sockets. The unique design also improves performance characteristics and reduces expensive rework and scrap while increasing production yields. The key to Andon's new design is a radiused hole at the bottom of the terminal. The terminal is then crimped over the solder ball beyond its hemisphere to encapsulate the solder ball, leaving just enough of the solder ball exposed to provide sufficient solder for soldering to a PCB.

Some ASICs with large ball counts using the conventional BGA terminal design experience coplanarity tolerance problems when there is no metal-to-metal contact between the solder ball and the PCB pad. The solder ball will tend to flow toward the gold plated land area under the microprocessor or socket terminal and not downward to make contact with the PCB pad.

With Andon's Rollerball Socket design, the critical distance between the terminal and the PCB pad is typically reduced from 0.036“ - 0. 40“ to 0.018“ - 0.022“. The solder becomes part of the „anchor“ cross section and provides additional mechanical strength to the connection as well as improved electrical connectivity. Because it also provides controlled dispersion of solder, the encapsulated solder ball in the new Rollerball Socket also reduces the risk of solder bridging inherent in conventional solder ball terminal designs.

Page updated at: 01/26/2015